The global bubble tea market size was valued at USD 2.99 Billion in 2024 to USD 5.9 Billion by 2032, growing at a CAGR of 8.9% in the forecast period (2025-2032), driven by increased global consumption, particularly in North America, Europe, and expanding Asian markets beyond Taiwan, China, and Southeast Asia.

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Glass Fiber Market Forecast 2032: Key Drivers and Strategic Insights

By 2032, the global market is expected to reach a multi-billion-dollar valuation, with strong contributions from both developed and emerging markets. Asia-Pacific remains the largest and fastest-growing region, with China and India spearheading both production and consumption. North America and Europe continue to invest in high-performance composites for aerospace and energy, further solidifying their roles in the global market.

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Positron Emission Tomography Market Outlook 2032: Innovation Driving Diagnostic Imaging Growth

The dominance of North America in the market landscape is likely to persist, attributed to robust healthcare infrastructure, rising healthcare expenditures, and high adoption of advanced imaging technologies.

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Prefilled Syringes Market Growth by Region: Insights from North America, Europe, and Asia (2032)

As of 2024, the prefilled syringes market was valued at USD 8.32 billion and is projected to reach USD 18.63 billion by 2032, growing at a compound annual growth rate (CAGR) of around 10.60% during the forecast period.

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Semiconductor Firm Lam Research Plans To Invest Rs 10,000 Crore ($1.2 billion) In India

Sesha Varadarajan, senior vice president of LamResearch, announced that the company signed a memorandum of understanding with Karnataka Industrial Areas Development Board. Through this partnership, the investment will be made in specific projects over the next few years, he said.

Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).